Carbon-based 3D array-reinforced thermal interface materials with highly oriented structure and superior thermal conductivity
Sijin Yan, Jie Zhang, Zenghui Qu, Yunqiang Guo, Xiaoyang Feng, Shibo Qu, Tongshun Wu*, Luyi Zou*
Carbon, 2025, 244, 120693
DOI: 10.1016/j.carbon.2025.120693
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